Teradyne unveils Photon 100
New automated platform targets high-volume testing of silicon photonics and co-packaged optics, addressing scaling challenges driven by AI and next-generation data centre demand.
Teradyne has introduced the Photon 100, a new automated test platform designed to support high-volume manufacturing of silicon photonics (SiPh) and co-packaged optics (CPO), as demand for optical interconnects continues to surge in AI-driven data centres.
Unveiled at OFC 2026, the Photon 100 integrates optical and electrical test capabilities within the company’s established UltraFLEXplus platform, enabling automated, high-throughput testing across multiple stages of production, including wafer-level, optical engine, and co-packaged module testing.
As the industry pushes toward scalable, energy-efficient interconnect solutions, manufacturers are facing increasing pressure to transition silicon photonics and co-packaged optics from development to volume production.
Test complexity and integration challenges remain key bottlenecks, particularly as devices move across different stages of the manufacturing flow.
The Photon 100 aims to address these issues by offering a unified test environment that reduces the need for multi-vendor integration.
According to Teradyne, the platform is designed to simplify operations while maintaining flexibility, allowing customers to tailor optical instrumentation and select preferred ecosystem partners for wafer- and die-level probing.
“The Photon 100 delivers a comprehensive, scalable, and integrated solution that simplifies the complexities of high-volume silicon photonics and co-packaged optics testing,” said Geeta Athalye, vice president of silicon photonics test at Teradyne.
With AI and high-performance computing continuing to drive bandwidth requirements, the need for efficient testing solutions is becoming increasingly critical.
Platforms such as Photon 100 are expected to play a key role in enabling faster time-to-market and supporting the broader adoption of silicon photonics and co-packaged optics technologies.
The launch reinforces Teradyne’s position in the photonics test space, as the industry moves toward more integrated and scalable manufacturing approaches to meet next-generation data centre demands.
