NLM Photonics samples high-performance SOH PICs
NLM Photonics is now sampling 1.6T and 3.2T silicon-organic hybrid photonic integrated circuits, demonstrating higher bandwidth, smaller size, and improved energy efficiency ahead of OFC 2026.
NLM Photonics is showcasing its latest silicon-organic hybrid (SOH) photonic integrated circuits (PICs) ahead of OFC 2026, taking place March 17–19.
The company is now sampling 1.6T and 3.2T SOH PICs to select customers, highlighting significant performance improvements over traditional silicon photonics.
The live demonstration will feature a 1.6T DR8 PIC built with NLM’s patented Selerion™-HTX organic material, achieving an order-of-magnitude improvement in performance over standard silicon photonic chips.
Both the 1.6T and 3.2T PICs were fabricated on Advanced Micro Foundry’s 200 mm GP O-band silicon photonics platform.
According to NLM Photonics, the 1.6T PIC is 40% smaller than standard 1.6T silicon photonic PICs, delivering 200 Gb/s per lane bandwidth, lower drive voltage, and higher extinction ratios. The 3.2T PIC delivers 110+ GHz performance in the same form factor.
These advancements build on record-setting demonstrations in 2025 and aim to bridge the gap between high-performance photonics and volume manufacturability.
“Silicon photonics has run head-on into fundamental bandwidth and efficiency limits at a point where it is built into more than half of transceivers in AI and datacom markets,” said Brad Booth, CEO of NLM Photonics. “Our platform unlocks performance breakthroughs while remaining scalable to volume production.”
NLM Photonics will host private demonstrations in Meeting Room 5544 at OFC 2026, alongside open house sessions on March 17 (1:00–2:00 PM PT), March 18 (11:00 AM–12:00 PM PT), and March 19 (3:00–4:00 PM PT).
The company’s SOH PICs demonstrate how integrating organic materials with silicon photonics can deliver higher bandwidth, improved energy efficiency, and smaller footprints, key priorities for next-generation photonic systems in AI, high-speed communications, and datacom applications.
