Modulators advance on silicon photonics platform
NLM Photonics demonstrates modulator compatibility with Tower Semiconductor’s high-volume PH18 platform, supporting scalable next-generation PIC development for AI and data centre applications.
NLM Photonics has demonstrated the compatibility of its silicon organic hybrid (SOH) modulator technology with Tower Semiconductor’s high-volume PH18M silicon photonics platform, marking an important step toward scalable deployment of next-generation photonic integrated circuits (PICs).
The validation follows initial processing of modulators from a multi-project wafer (MPW) run on Tower’s PH18M platform. NLM carried out key process steps including oxide open etching, deposition of its Selerion™-HTX organic electro-optic material, encapsulation, poling, and crosslinking.
The results confirm that the PH18 process can support integration of advanced modulator technologies within a manufacturable silicon photonics flow.
The milestone is significant for PIC designers and foundries seeking pathways to higher bandwidth without departing from established silicon photonics infrastructure.
Hybrid modulator approaches are gaining attention as a “fab-friendly” route to improving performance while maintaining compatibility with existing processes.
According to NLM Photonics, the work will help define a Process Development Kit (PDK) expected later this year, enabling broader access to the technology for customers using the PH18 platform.
Tower Semiconductor said the results highlight the flexibility of its platform to incorporate emerging photonic device architectures.
For NLM, the validation supports a roadmap toward higher data rates, with early indications pointing to the potential for 400G per lane performance as process optimisation continues.
The development underscores growing momentum behind new material approaches in silicon photonics, as the industry works to meet rising bandwidth and efficiency demands driven by AI and data centre applications.
