OpenLight wins volume orders for 800G and 1.6T PICs
OpenLight has secured its first volume production orders for 800G and 1.6T photonic integrated circuits from NewPhotonics, built on its PH18DA indium phosphide-on-silicon platform developed with Tower Semiconductor. The milestone reflects growing demand for highly integrated PICs to support AI and hyperscale data centre connectivity.
OpenLight has announced its first volume production orders for PICs manufactured on its PH18DA indium phosphide (InP) on silicon photonic platform.
The platform, developed in collaboration with Tower Semiconductor, enables the integration of active photonic components, including lasers, directly onto a monolithic silicon photonics chip.
The orders come from NewPhotonics and support the company’s 800G and 1.6T optical connectivity solutions designed for AI and hyperscale data centre infrastructure.
By integrating lasers and other active components into a single photonic IC, the designs aim to improve bandwidth density, reduce power consumption, and shrink the overall footprint compared with conventional discrete silicon photonics implementations.
For OpenLight, the move into volume production represents an important transition from technology development to large-scale manufacturing.
The PH18DA process enables heterogeneous III-V-on-silicon integration and is designed to support high-yield production of laser-enabled PICs for next-generation optical interconnects.
The production designs were developed using OpenLight’s process design kit, allowing photonic functions to be integrated into a single chip architecture.
This approach helps reduce optical losses and packaging complexity while improving signal performance and energy efficiency, key requirements for AI data centre networks operating at 800G and 1.6T speeds.
The milestone highlights the growing demand for highly integrated photonic solutions capable of supporting the scaling requirements of AI and hyperscale cloud infrastructure.
