NHanced to present at ECTC 2026
Research focuses on predictive hybrid bonding reliability modelling for advanced 3D integration and heterogeneous packaging.
NHanced Semiconductors and researchers from the Florida Semiconductor Institute at the University of Florida will present a new predictive reliability model for hybrid bonding at the 2026 Electronic Components and Technology Conference (ECTC).
It will be addressing key challenges associated with advanced 3D integration and heterogeneous semiconductor packaging.
The presentation, led by NHanced vice-president Dr. Charles Woychik alongside Dr. Navid Asadi’s research team, will detail a metrology workflow combining pre-bond inspection and post-bond analysis to improve bonding yields, alignment accuracy and process control in high-density packaging architectures.
As semiconductor devices continue scaling toward finer interconnect pitches and ultra-thin dies, hybrid bonding has become an increasingly important technology for wafer-to-wafer and die-to-wafer integration in AI and high-performance computing applications.
However, the transition to sub-micron bonding dimensions has introduced growing reliability concerns, including wafer warpage, interfacial delamination, stress-induced deformation and bonding misalignment.
To address these issues, the team developed a predictive workflow beginning with pre-bond inspection using shadow moiré interferometry, a non-contact optical metrology technique capable of generating full-field warpage maps prior to bonding.
Post-bond analysis is then performed using scanning electron microscopy on specially prepared cross-sections to visualise voids, delamination and other interfacial defects.
By correlating pre-bond warpage data with post-bond defect formation, the methodology enables predictive algorithms designed to improve bonding integrity, process optimisation and manufacturing yield for next-generation 3D integration.
ECTC 2026 will take place from May 26–29 in Orlando, Florida.
