Photon Bridge, PHIX team on AI photonics
Photon Bridge and PHIX join forces to bring integrated external laser sources from design to volume production for co-packaged optics and high-density interconnects.
Photon Bridge and PHIX have announced a collaboration to advance DWDM external laser-source transmit optical sub-assemblies for use in AI data centre infrastructure.
The work targets co-packaged optics and dense optical interconnects, where scalable and energy-efficient solutions are increasingly required.
Photon Bridge is responsible for end-to-end product development, including multi-wavelength laser design, photonic integration, packaging architecture and thermal modelling.
The company is positioning itself as a full-stack photonics supplier delivering deployment-ready optical modules.
PHIX brings its expertise in advanced photonic packaging and its proven path from prototype to volume manufacturing.
Its approach focuses on developing packaging solutions to manufacturing readiness before transfer to high-volume production, supporting a smoother scale-up process.
The companies say the partnership reflects a shared goal of strengthening the Dutch photonics ecosystem while accelerating the availability of high-performance optical engines for next-generation AI systems.
