Sivers and GlobalFoundries expand SiPh deal
Partnership targets laser integration and co-packaged optical engines for next-generation high-bandwidth connectivity.
Sivers Semiconductors and GlobalFoundries have announced a collaboration to advance silicon photonics-based optical connectivity solutions for AI data centre infrastructure, focusing on high-bandwidth, energy-efficient interconnect technologies.
As part of the agreement, Sivers’ laser arrays will be integrated into reference designs built on GlobalFoundries’ silicon photonics platform.
The collaboration supports multiple optical connectivity architectures, including co-packaged optics (CPO), linear pluggable optics (LPO) and emerging optical interconnect solutions.
The companies will also incorporate Sivers’ laser technology into GlobalFoundries’ Silicon Photonics Co-packaged Advanced Light Engine (SCALE™) platform, designed to support next-generation optical sub-assemblies and co-packaged optical architectures for data centre applications.
According to the companies, the joint development aims to address growing demand for higher bandwidth density, improved energy efficiency and scalable optical connectivity as AI workloads drive rapid expansion of hyperscale data centre infrastructure.
The collaboration reflects broader industry momentum toward silicon photonics and co-packaged optical systems as key enablers for future AI-scale computing architectures.
