Credo completes DustPhotonics acquisition
Deal strengthens Credo’s silicon photonics and optical interconnect portfolio for next-generation AI infrastructure and co-packaged optics.
Credo Technology Group Holding Ltd. has completed its acquisition of DustPhotonics, strengthening its position in silicon photonics and optical connectivity solutions for next-generation AI infrastructure.
The acquisition adds DustPhotonics’ silicon photonics photonic integrated circuit (SiPh PIC) technology to Credo’s optical interconnect portfolio, expanding capabilities across 800G, 1.6T and 3.2T near-packaged optics (NPO) and co-packaged optics (CPO). The combined technologies position Credo with a vertically integrated connectivity stack spanning SerDes, DSPs, silicon photonics and system-level integration.
The move comes as hyperscale AI deployments continue to drive demand for higher bandwidth, lower power consumption and scalable optical interconnect architectures in data centers.
“With the addition of DustPhotonics, we are advancing a powerful end-to-end optical connectivity platform focused on reliability and power efficiency,” said Bill Brennan, President and CEO of Credo.
Credo said its combined portfolio of ZeroFlap optical transceivers, optical DSPs and silicon photonics products is expected to become a significant growth driver in fiscal 2027, supported by increasing adoption in AI networking applications.
Ronnen Lovinger, Vice President of Silicon Photonics at Credo, said silicon photonics is expected to play an increasingly central role in AI-driven optical connectivity, enabling the bandwidth and efficiency requirements of next-generation infrastructure.
The acquisition highlights the growing importance of integrated optical technologies and co-packaged optics as AI workloads continue to reshape data center networking architectures.
