Lumentum boosts CPO growth
Lumentum is increasing investment in co-packaged optics and high-power laser technologies as demand grows for optical interconnects in next-generation AI data centres.
Lumentum is expanding its co-packaged optics (CPO) portfolio as it looks to capitalise on growing demand for AI networking infrastructure, positioning the technology as a key part of its long-term growth strategy.
The company is scaling production of ultra-high-power laser chips designed for CPO applications, with manufacturing progressing on schedule and commercial deployments expected to increase as AI infrastructure investment continues to accelerate.
Lumentum's CPO strategy builds on its existing expertise in semiconductor lasers and photonic components and complements its broader AI networking portfolio, which includes pump lasers, narrow-linewidth laser assemblies, electro-absorption modulated laser (EML) chips, cloud transceivers and optical circuit switches (OCS).
As hyperscale AI data centres continue to expand, traditional electrical interconnects are increasingly constrained by bandwidth and power consumption.
Co-packaged optics is emerging as a promising solution by bringing optical connectivity closer to compute devices, improving performance while reducing energy requirements.
Alongside competitors including Marvell and Broadcom, Lumentum is investing in technologies that support next-generation optical interconnect architectures.
The company believes growing adoption of CPO and optical switching technologies will strengthen its position in the evolving AI networking market.
With AI workloads continuing to drive demand for higher bandwidth and more efficient data movement, co-packaged optics is expected to play an increasingly important role in future data-centre infrastructure, creating new opportunities for photonics suppliers across the PIC ecosystem.
