HyperLight raises $80M to scale TFLN PIC
HyperLight has secured $80 million in Series C funding to expand manufacturing capacity and accelerate deployment of its thin-film lithium niobate photonic integrated circuit technology for AI infrastructure.
HyperLight has closed an $80 million Series C funding round to support the expansion of its thin-film lithium niobate (TFLN) photonic integrated circuit (PIC) platform, targeting growing demand from AI and high-performance networking applications.
The funding will be used to increase manufacturing capacity, support customer qualification programmes, scale the company's TFLN Chiplet Platform and strengthen partnerships across foundry, semiconductor networking and systems integration ecosystems.
HyperLight's TFLN Chiplet Platform is designed to support a range of optical networking applications, from short-reach data centre interconnects to coherent communications and co-packaged optics (CPO).
The company said its platform combines high modulation bandwidth, low drive voltage and low optical loss to help reduce power consumption as AI networks move to higher data rates.
The investment follows HyperLight's recently announced manufacturing partnership with UMC and Wavetek, which will enable high-volume foundry production of the company's TFLN chiplets on both 6-inch and 8-inch wafers.
According to HyperLight, the latest funding round brings together companies from across the AI infrastructure value chain, reflecting growing industry interest in photonic technologies capable of supporting next-generation computing and networking systems.
The company is currently supporting 200G-per-lane optical solutions and has begun sampling 400G-per-lane technologies as demand for higher-bandwidth AI infrastructure continues to grow.
