Crealights Technology has debuted on the Main Board of the Hong Kong Stock Exchange, with the silicon photonics specialist aiming to strengthen its position in AI optical interconnects through expanded manufacturing, R&D and global market growth.
The company, which focuses on silicon photonics (SiPh) technologies for AI data centres, secured HK$763 million from six cornerstone investors as part of its initial public offering.
Crealights has developed an end-to-end silicon photonics platform spanning chip design, wafer-level testing, packaging, optical transceivers and finished optical networking products.
According to the company, it is among the first in China to achieve mass production of self-designed silicon photonics chips on a 12-inch wafer platform.
Its vertically integrated manufacturing approach supports a range of AI networking applications, including active optical cables (AOCs), pluggable optical transceivers and next-generation near-packaged optics (NPO) and co-packaged optics (CPO).
The company said its 1.6T silicon photonics transceivers are currently undergoing customer validation, while 3.2T and 6.4T products are under development.
Crealights also highlighted its "Wafer-In, Module-Out" manufacturing platform, which integrates wafer testing, back-end processing and module assembly to improve production yield and shorten product development cycles.
The company reported revenue growth from RMB175 million in 2023 to RMB1.22 billion in 2025, driven by increasing demand for AI optical interconnects.
It plans to use the proceeds from its listing to expand production capacity, accelerate next-generation silicon photonics products and strengthen its global market presence.
As demand for higher-bandwidth, lower-power optical interconnects continues to grow, Crealights is positioning silicon photonics as a key technology for future AI computing infrastructure.
