SMART Photonics and GF join forces
The collaboration combines silicon photonics with InP lasers and SOAs for AI data centres, optical transceivers and LiDAR.
SMART Photonics and GlobalFoundries (GF) have partnered to develop an open-access foundry service combining GF's silicon photonics platform with SMART Photonics' indium phosphide (InP) photonic integrated circuits (PICs).
The companies say the service will enable optical products that combine the scalability of silicon photonics with active InP components, including lasers and semiconductor optical amplifiers (SOAs).
Under the collaboration, SMART Photonics' InP lasers and SOAs are integrated into a silicon-based cavity on GF's silicon photonics platform using flip-chip technology. The companies have spent more than a year co-engineering the process, focusing on dimensional compatibility and efficient optical coupling.
The approach is intended to support smaller and lower-cost photonic chiplets while simplifying production and reducing time to market. Target applications include AI data centres, optical transceivers and LiDAR systems.
General availability of the joint open-access foundry service is targeted for the second half of 2027.
The companies describe the collaboration as a way to combine two established photonics material platforms within a single manufacturing approach, potentially enabling greater integration of active and passive photonic components.
