MicroVision unveils AI photonics module
Scantinel’s external laser module targets optical connectivity challenges in AI data centres.
MicroVision has introduced a new external laser small-form-factor pluggable (ELSFP) module from its Scantinel subsidiary, targeting optical connectivity requirements in AI data centres and co-packaged optics (CPO).
The module is built around a two-dimensional photonic integrated circuit (PIC) and is designed to provide a compact, externally accessible laser source for high-speed optical systems. MicroVision says the approach could simplify optical architectures while addressing power, space and connectivity requirements in next-generation AI infrastructure.
The ELSFP concept separates the laser source from the photonic processing elements, allowing the optical source to be positioned externally while maintaining a compact pluggable form factor. This could support emerging CPO architectures where optical interfaces must scale alongside increasingly dense compute and networking systems.
MicroVision is now evaluating potential licensees and development partners for the technology as it works towards commercial applications in AI data-centre optical interconnects.
