Coherent launches PhotonLink
Integrated platform combines photonic components, assembly and test for CPO, NPO and chip-to-chip applications.
Coherent has launched PhotonLink, an integrated optics platform designed to combine photonic technologies, precision assembly and test capabilities for next-generation AI data centre networks.
The platform brings together InP lasers, VCSEL arrays, silicon photonics, isolators, specialty fibre, micro-optics and detectors. Coherent integrates these technologies into external laser sources, precision fibre assemblies and optical modules for co-packaged optics (CPO), near-packaged optics (NPO) and emerging chip-to-chip connectivity.
Coherent said PhotonLink is intended to simplify the integration of optical technologies by providing components and complete optical assemblies through a single platform. Its capabilities span four stages of the optical path: generate, shape, guide and receive.
The company currently has more than 10 CPO and more than 10 NPO customer engagements, alongside more than five engagements focused on emerging chip-to-chip connectivity. Revenue from the platform is expected to begin ramping in the fourth quarter of 2026.
PhotonLink builds on Coherent's manufacturing infrastructure, which has produced more than 300 million InP lasers and more than one billion InP and GaAs photodetectors. Coherent is also expanding its 6-inch InP and specialty fibre manufacturing capacity to support the platform's ramp.
