Semtech joins XPO MSA
Semtech’s modulator drivers and TIAs target high-density optical interconnects for AI infrastructure
Semtech has joined the eXtra-dense Pluggable Optics Multi-Source Agreement (XPO MSA), bringing its portfolio of 200G/lane modulator driver and transimpedance amplifier (TIA) ICs to the emerging high-density optical transceiver ecosystem.
The XPO MSA is developing a 12.8T optical transceiver form factor designed for AI networking applications. The current generation supports 200G/lane electrical interfaces and uses an integrated liquid-cooling architecture, with a roadmap toward 400G/lane.
Semtech said its optical IC portfolio is designed to support XPO transceiver development from early prototypes through volume deployment. The portfolio includes quad and octal TIAs and Mach-Zehnder modulator drivers supporting different channel pitches, including configurations down to 375mm.
The devices feature high linearity, integrated equalisation, telemetry capabilities and low latency, with the aim of supporting high-density optical links in AI network switches and fabrics.
The move comes as AI infrastructure drives demand for greater bandwidth density while maintaining power efficiency and serviceability. XPO is intended to increase optical density at the network faceplate while retaining the flexibility of pluggable optics.
Semtech will demonstrate its XPO driver and TIA solutions at ECOC 2026 in Málaga, Spain.
The company’s participation in the XPO MSA adds another semiconductor supplier to an ecosystem focused on scaling optical connectivity alongside the increasing bandwidth requirements of AI infrastructure.
