NHanced targets 3D photonic integration
NHanced Semiconductors president Robert Patti will outline how advanced packaging could enable multi-terabit photonic systems at the 2026 3DIC Conference.
NHanced Semiconductors president Robert Patti will present an invited talk on 3D photonic integration at the IEEE International 3D Systems Integration Conference (3DIC) 2026.
Patti's presentation, titled “3D Photonic Integration: Enabling Multi-Terabit Operation,” will examine how advanced packaging technologies can support the integration of photonic and electronic devices for higher-bandwidth systems.
The presentation will cover advances in device alignment that are enabling new approaches to disaggregation and chiplet-based architectures. Patti will also discuss the growing availability of thin-film lithium niobate (TFLN) foundry platforms, which are supporting photonic transceiver operation beyond 1.6 Tb/s.
According to NHanced, TFLN-based optical switches and interconnects can provide high bandwidth with low insertion loss and power consumption. Advanced packaging can further enable heterogeneous integration and the miniaturisation and co-location of photonic circuit elements.
Patti will outline current capabilities and future technology developments for advanced packaging in photonic applications, highlighting the role of 3D integration in scaling optical and electronic systems.
Patti will also join a panel discussion titled “The Self-Sustaining Economics of a Truly Open Chiplet Market.” The session will examine the development of open chiplet ecosystems and will include representatives from TSMC, Siemens EDA and Zero ASI.
NHanced Semiconductors, a QCi company, operates as an advanced packaging foundry with capabilities spanning chiplets, 3D ICs, silicon interposers, 2.5D integration, photonics and microfluidics. The company supports standard and non-standard substrates, III-V compound semiconductors and specialised materials.
The company's photonic packaging activities highlight the growing convergence between advanced semiconductor packaging and photonic integration as data rates and system bandwidth requirements continue to increase.
