Fujitsu develops quantum PIC prototype
Fujitsu has developed a working diamond-spin quantum computer prototype integrating tin-vacancy centres with photonic integrated circuits, targeting scalable quantum systems through high-fidelity optical connectivity.
Fujitsu has developed a working prototype of a diamond-spin quantum computer that incorporates tin-vacancy (SnV) centres in photonic integrated circuits (PICs), marking a step toward scalable quantum computing architectures.
The prototype was developed through a collaboration between Fujitsu, Delft University of Technology and QuTech, following joint research that began in 2020. It uses diamond-spin technology and photonic integration to provide optical connectivity between quantum components.
According to Fujitsu, the system can operate at approximately -271.6°C, a temperature slightly higher than that typically used by superconducting quantum computers.
The company has also demonstrated operation of the prototype through its Hybrid Quantum Computing Platform without requiring users to have specialist knowledge of the underlying quantum hardware.
The integration of SnV centres with PICs is intended to support a modular approach to quantum computing. Optical connectivity can enable quantum modules to communicate while maintaining high-fidelity operations, potentially allowing larger systems to be constructed from interconnected quantum processors.
Fujitsu is also investigating the potential to combine diamond-spin quantum systems with superconducting quantum computers. Such hybrid architectures could use the respective characteristics of the two technologies to expand computational capabilities.
The prototype forms part of Fujitsu's longer-term quantum-computing roadmap, which targets a system with 250 logical qubits by fiscal 2030 and 1,000 logical qubits by fiscal 2035.
The development highlights the growing role of photonic integration in quantum computing, where PICs can provide compact optical interfaces and connectivity between quantum devices. Further advances in fabrication, integration and optical interconnects will be required to translate the prototype into larger-scale quantum systems.
