ficonTEC and HTSI partner on CPO test
ficonTEC and Hermes Testing Solutions (HTSI) have announced a strategic cooperation to scale electro-optical wafer-level testing for co-packaged optics (CPO) in Taiwan.
The partnership will initially focus on ficonTEC’s INS-2 double-sided electro-optical wafer-level test platform for advanced silicon photonics. The 300 mm system enables electrical probing from the top of the wafer while providing precision optical access from below.
The platform features automated wafer handling, six-axis optical alignment, vision, probe inspection and cleaning, and is designed to integrate with industry-standard automated test equipment (ATE).
The companies will combine ficonTEC’s CPO test and silicon photonics expertise with HTSI’s semiconductor equipment manufacturing, engineering and local service capabilities. The collaboration will support system integration, installation, qualification and continuous improvement as CPO moves towards high-volume manufacturing.
The companies will also focus on manufacturing metrics including throughput, equipment availability and process stability, with customer feedback incorporated into ongoing platform development.
