Mesh Optical raises $50M for scalable PIC transceivers
Mesh Optical Technologies has secured over $50 million in funding to scale production of its Alpha C1 optical transceiver, aimed at powering next-generation AI clusters and high-performance data centers.
The Alpha C1 transceiver leverages flip chip die bonding, the same advanced packaging technology used in modern processors, enabling scalable integration of photonic and electronic components.
This approach addresses the limitations of traditional U.S. optical systems, which are typically assembled manually at low volumes.
Mesh’s transceiver converts electrical signals to light at 1.6 Tbps, offering improved power efficiency, lower latency, and higher reliability.
The device incorporates an advanced distributed feedback (DFB) laser, robust at high temperatures, and implements 8-lane 224 GHz PAM4 modulation with fully optimised trace routing to the optical engine.
The company’s team draws experience from SpaceX, Intel, and other high-volume advanced manufacturing environments, aiming to transform optical transceiver production from laboratory-scale assembly to mass manufacturing capable of millions of units per year.
With the growing demand for optical interconnects in AI and high-performance computing, Mesh Optical Technologies’ scalable approach positions it as a key player in next-generation photonics and PIC integration.
