LIGENTEC and X-FAB strengthen european photonics with SOI and TFLN integration
LIGENTEC and X-FAB have expanded their collaboration to offer a unified photonics platform, combining X-FAB’s XPH90 Silicon Photonics (SOI) technology with LIGENTEC’s low-loss Silicon Nitride (SiN) portfolio. The move aims to streamline customer access to advanced photonic solutions for communication, computing, quantum, and sensing markets.
The partnership will focus on heterogeneous integration of active and passive components, including lasers, modulators, and photodetectors, with a special emphasis on thin-film lithium niobate (TFLN) for high-performance electro-optic applications.
Both companies plan to scale TFLN-on-SiN and TFLN-on-SOI production on 200 mm wafers, supporting a path from R&D to industrial-scale manufacturing.
“By integrating XPH90 SOI with our SiN platform, we provide versatile, scalable solutions for next-generation photonics,” said Rudi De Winter, X-FAB CEO.
Thomas Hessler, CEO of LIGENTEC, added, “This collaboration enables seamless transition from prototyping to volume production, giving customers early access to advanced technology stacks for sensing, connectivity, and computing applications.”
Through this joint approach, LIGENTEC and X-FAB aim to strengthen Europe’s position in industrial-scale photonic integration and build a robust supply chain for high-volume PIC production.
