EV Group showcases hybrid bonding and maskless lithography technologies at SEMICON Korea 2026
EV Group (EVG) announced it will highlight its latest solutions for heterogeneous integration and advanced packaging at SEMICON Korea 2026, taking place February 11–13 at the COEX Exhibition Centre in Seoul.
At the event, EVG will showcase key technologies supporting next-generation chip integration, including its GEMINI FB production wafer bonding systems for hybrid and fusion bonding, the EVG40 die-to-wafer (D2W) overlay metrology system, the IR LayerRelease layer transfer platform, and the high-throughput LITHOSCALE XT maskless exposure system.
EVG’s process solutions enable manufacturing advances across high-bandwidth memory (HBM), advanced memory devices, MEMS, sensors, and fine-pitch wafer probe card manufacturing applications where advanced packaging and 3D integration are critical to performance and yield.
The company will also participate in two technical sessions at SEMICON Korea focused on its IR LayerRelease and maskless lithography platforms. EVG will exhibit at booth DS26.
“Technology companies and research institutes in Korea continue to play a pivotal role in driving innovation across advanced memory, 3D integration, and packaging technologies,” said Georg Berger, Regional Sales Manager, Asia/Pacific at EV Group. “EVG is proud to support customers in Korea with field-proven solutions and strong local application and service capabilities.”
Justin Yun, General Manager of EV Group Korea, added that SEMICON Korea provides an important opportunity to showcase advances in hybrid bonding, lithography, and layer transfer while collaborating with industry leaders shaping the future of semiconductor manufacturing.
