Empower rolls out AI silicon capacitors
Empower Semiconductor has launched three new embedded silicon capacitors (ECAPs) designed to address power integrity challenges in next-generation AI and high-performance computing (HPC) processors, where advanced packaging is increasingly critical to performance scaling.
The new ECAP portfolio includes the EC2005P, offering 9.34µF capacitance in a 2 mm × 2 mm package; the EC2025P, with 18.68µF in a 4 mm × 2 mm form factor; and the EC2006P, delivering 36.8µF in a compact 4 mm × 4 mm footprint.
The devices are engineered for embedded deployment within processor packages and substrates, enabling higher capacitance density directly at the point of load.
As AI processors drive extreme current densities and faster transient response, traditional board-level capacitors are no longer sufficient. Embedding silicon capacitors into the package has become a key advanced packaging strategy to improve power delivery network (PDN) performance.
Empower’s ECAPs feature ultralow equivalent series inductance (ESL) and resistance (ESR), delivering wide-bandwidth, low-impedance power delivery to support demanding AI and HPC workloads.
“These new ECAPs are a proven and practical way to deploy higher capacitance density into a smaller footprint right at the package level of the AI processor,” said Steve Hertog, senior vice president of worldwide sales at Empower Semiconductor.
Empower will further discuss PDN optimisation, embedded capacitors, and its Crescendo vertical power delivery platform at upcoming industry events, including Chiplet Summit and DesignCon 2026, highlighting the growing role of advanced packaging in enabling next-generation processor performance.
