Over 30 mW per-channel laser output at wafer-scale
Photon Bridge, a photonics semiconductor company, has demonstrated wafer-scale validation of its heterogeneous photonics platform for multi-wavelength light engines, delivering over 30 mW output per channel at silicon chip edge facets in continuous-wave operation at room temperature.
The achievement meets per-channel requirements for next-generation 1.6T and 3.2T co-packaged optical (CPO) engines, enabling reduced fibre count and improved rack-level energy efficiency.
Unlike traditional single-colour lasers that require high-power discrete devices, Photon Bridge combines multiple wavelengths on a single silicon photonics interposer, simplifying assembly, reducing fibre count, and improving thermal management.
The platform integrates lasers and wavelength filters on a single photonic integrated circuit (PIC), eliminating discrete micro-optics and leveraging commercial III–V and 200 mm silicon photonics foundries.
This approach is designed for volume production, with OSAT-compatible assembly reducing III–V laser integration time by up to 80×. Initial wafer-scale testing demonstrated over 92% of interconnections meeting performance specifications.
“Delivering more than 30 mW from a single integrated channel at wafer scale validates both the power handling and manufacturability of our platform,” said Paul Marchal, CEO of Photon Bridge. “The architecture scales to multiple wavelengths per fibre, achieving higher aggregate output without pushing individual lasers to extreme power densities. We are now focused on industrialisation and customer qualification for high-volume deployment.”
The platform is also compatible with quantum dot laser technology, offering potential for isolator-free operation and further simplifying system-level design for high-density optical engines.
Photon Bridge will showcase its multi-wavelength light engines at the OFC Conference, booth 757, highlighting their role in next-generation AI-driven CPO systems.
