PHIX opens US photonic packaging facility
New Bozeman site expands US-based PIC packaging capacity and supports photonics commercialisation.
PHIX has opened a new photonic packaging facility in Bozeman, Montana, expanding its US manufacturing presence and adding advanced packaging capabilities to the state’s growing photonics ecosystem.
The facility is part of the Integrated Photonics Ecosystem, a project led by the Montana Photonics & Quantum Alliance (MPQA) and funded by the US Economic Development Administration through its Tech Hubs programme.
The initiative aims to connect photonic chip development and testing with packaging and product development to accelerate commercialisation.
PHIX’s facility will provide photonic integrated circuit (PIC) packaging and assembly capabilities, complementing testing and development facilities at Montana State University and product-development support from PhotonIQ.
The combined infrastructure is intended to help companies move photonic technologies from research and development towards commercial manufacturing.
PHIX specialises in assembling optoelectronic modules based on indium phosphide, silicon photonics, silicon nitride and lithium niobate. Its capabilities include chip-to-chip hybrid integration, fibre-array coupling, electrical interfacing and free-space optics integration.
According to PHIX CEO Albert Hasper, the Bozeman facility brings the company closer to US customers and provides a platform to expand its presence in the country’s growing photonics industry.
The investment also supports the development of domestic photonics manufacturing capacity and workforce skills, with the wider ecosystem bringing together industry, research institutions and workforce partners.
The new facility adds to PHIX’s production capabilities in Europe and the United States, supporting customers seeking scalable, regionally based manufacturing for photonic technologies.
