Fraunhofer HHI advances indium phosphide photonics for high-speed data communication
The Fraunhofer Heinrich Hertz Institute (HHI) is pushing the boundaries of photonic chip manufacturing, with indium phosphide (InP) at the heart of its high-speed data communication technologies. Dr. Kristijan Posilovic, Head of Technology and Infrastructure, highlighted the material’s importance for low-loss fibre optic communication during a recent visit by the Research Factory Microelectronics Germany (FMD).
InP enables efficient light emission at precise wavelengths, which is essential for photonic chips that power everything from high-speed fibre networks to semiconductor lasers for fusion research. Fraunhofer HHI is scaling production to 6-inch wafers, a step aimed at improving industrial usability while minimising structural defects in larger crystals.
The institute’s photonic chips are also applied in energy-efficient AI data centres, reflecting the growing focus on “green photonics.” Collaboration within the FMD network allows Fraunhofer HHI to combine its technological expertise with partner designs and advance hybrid integration of InP with polymer platforms.
“The moments when a wafer passes rigorous testing after months of work are what make our cleanroom efforts truly rewarding,” Posilovic adds, underscoring the dedication behind the institute’s pioneering work.
