CCRAFT secures funding to scale swiss TFLN photonic chips
Swiss photonics foundry CCRAFT has received CHF 2.5 million in funding from Innosuisse, the Swiss Innovation Agency, to accelerate the industrialization of its thin-film lithium niobate (TFLN) photonic integrated circuits. The two-year project aims to expand CCRAFT’s design and manufacturing capabilities to meet growing global demand for high-performance, energy-efficient optical chips powering next-generation AI data centers.
As data traffic surges with the expansion of AI infrastructure, existing photonic interconnects are approaching their limits in speed and energy efficiency. TFLN has emerged as a leading material for ultra-high-speed, low-power optical links, capable of supporting data transmission beyond 1.6 Tbit/s while consuming less than 1 pJ/bit. CCRAFT’s proprietary platform bridges the gap between research and large-scale manufacturing, positioning Switzerland as a key player in the global photonics supply chain.
Building on over six years of R&D at the Swiss Center for Electronics and Microtechnology (CSEM), CCRAFT operates a 150 mm wafer manufacturing line and delivers monolithic TFLN chips alongside hybrid TFLN–silicon photonic solutions. The Innosuisse-supported project will enhance process reliability, expand the company’s component library, and prepare for qualification with hyperscale customers.
“This support reinforces our mission to transform Swiss innovation into global industrial leadership,” said Hamed Sattari, CEO of CCRAFT. “We are advancing toward multi-million-chip annual capacity and preparing the transition to 200 mm wafers to further boost efficiency and throughput.”
CCRAFT plans to release its datacom Process Design Kit (PDK) in 2026, followed by qualification for high-volume production in 2027. The initiative marks a major step toward establishing a reliable European manufacturing base for TFLN photonic chips, enabling faster, greener optical interconnects for AI, data communication, and computing markets.
