CITC joins TNO to strengthen chip packaging in Nijmegen
The Chip Integration Technology Centre (CITC) will become part of TNO, marking a major step in advancing chip packaging research and innovation. The integration, effective January 1, 2026, aims to secure CITC’s long-term continuity and strengthen the Netherlands’ semiconductor ecosystem, connecting Nijmegen with other hubs such as Eindhoven.
CITC, founded in 2019 by TNO and TU Delft, has developed into a broad R&D hub for advanced chip packaging technologies. By joining TNO’s High Tech Industry unit, CITC will expand research efforts, accelerate innovation, and maintain its presence at the Noviotech Campus in Nijmegen.
Arnaud de Jong, TNO’s director of High-Tech Industry, said, “Integrating CITC allows us to intensify our work in advanced chip packaging and contribute to a strong, future-proof semiconductor ecosystem in Nijmegen.” Jeroen van den Brand, CITC general manager, added that the move strengthens CITC’s international position as a centre of expertise.
TU Delft remains closely involved, ensuring that the collaboration continues to support the growth of chip integration and packaging technologies across the region.
