Sivers teams with WIN to scale DFB laser production
The companies plan to leverage WIN’s compound semiconductor manufacturing expertise to meet growing demand for Sivers’ photonic solutions, expanding its presence in the AI datacentre market
Sivers Semiconductors has announced a partnership with WIN Semiconductors to enhance production of Sivers Semiconductors’ proprietary high-power DFB lasers and laser arrays technology. The company says this strategic collaboration paves the way for high-volume manufacturing of critical components for coarse wavelength division multiplexing (CWDM) and dense wavelength division multiplexing (DWDM) applications.
WIN Semiconductors will serve as an outsourced manufacturing partner for Sivers Semiconductors, aiming to enable the company to scale production and meet the growing demand for its photonic solutions. Sivers says this collaboration marks a significant milestone, combining WIN Semiconductor’s extensive expertise in compound semiconductor manufacturing with Sivers’ advanced laser chip technology.
“This partnership is a crucial step in our strategy to scale our manufacturing capabilities and ensure our customers receive high-quality, high-performance photonic solutions with greater efficiency and reliability,” said Vickram Vathulya, CEO of Sivers Semiconductors. “By partnering with WIN Semiconductor, we are enhancing our production capabilities and accelerating time-to-market for our customers, supporting applications such as next-generation optical interconnects, silicon photonics, and optical I/O for co-packaged optics.”
According to Sivers, WIN Semiconductors brings decades of expertise in manufacturing compound semiconductors, offering state-of-the-art fabrication facilities and a proven track record of delivering high-volume, high-quality production. By integrating WIN Semiconductors’ manufacturing capabilities with Sivers Semiconductors’ advanced technology, the partnership aims to drive innovation and strengthen the supply chain for CWDM and DWDM applications.
“We’re excited to work alongside the Sivers team to bring their advanced DFB lasers and arrays to high-volume production,” said William Chang, GM of WIN Semiconductors. “This collaboration combines our manufacturing expertise with Sivers’ innovation to drive next-level performance in CWDM and DWDM applications.”
Sivers adds that the collaboration underscores its commitment to expanding its presence in the AI datacentre market and reinforcing its position as a leader in the photonics industry. By leveraging WIN Semiconductors’ world-class manufacturing expertise, the company says it is poised to meet the increasing global demand for advanced laser chips.
