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Technical Insights
Friday 24th November 2023
Bringing photonic technology to 3D-stacked computing systems
Friday 24th November 2023
State-of-the-art electronic photonic design automation
Wednesday 13th September 2023
Photonic integration and packaging with Photonic Wire Bonding and facet-attached micro-optical elements
Wednesday 13th September 2023
Broadband PICs with 3 µm SOI technology
Wednesday 13th September 2023
Photonic integrated circuit packaging, from prototype to production scale-up
Wednesday 13th September 2023
Component viability risks bursting the quantum bubble
Wednesday 13th September 2023
Enabling coherent optical communication with InP PICs
Friday 14th July 2023
PIC International 2023: The growth of silicon photonics continues
Friday 14th July 2023
Automation: an essential tool for testing Photonic Integrated Circuits
Friday 14th July 2023
Datacom will be the main driver for Silicon Photonics
Friday 14th July 2023
Component viability risks bursting the quantum bubble
Wednesday 12th July 2023
How integrated photonics can transform the agrifood industry
Thursday 30th March 2023
Advancing quantum photonics with transfer printing
Wednesday 29th March 2023
Getting photonic crystal nano-lasers on silicon
Wednesday 29th March 2023
Building phononic integrated circuits with GaN
Tuesday 28th March 2023
On-board photonics closing the gap between PICs and glass fibers
Tuesday 28th March 2023
Accelerating the photonics transition with much shorter R&D
Tuesday 28th March 2023
High-performance monolithically integrated edge couplers
Monday 27th February 2023
Commercialization accelerates for POET Technologies’ platform technology
Thursday 24th November 2022
Silicon photonics is driven by data center applications
Wednesday 23rd November 2022
Improving optical coupling for hybrid photonic packaging
Wednesday 23rd November 2022
Wafer-level nanoimprint technology for innovative packaging
Wednesday 23rd November 2022
Enabling next generation photonic integration and packaging solutions
Tuesday 22nd November 2022
The best of both worlds: Mature hybrid integration & its applications
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