EVG advances quantum chip packaging
EVG is applying its bonding and heterogeneous integration technologies to support scalable quantum computing and photonic chip manufacturing.
EV Group (EVG) has announced that it is expanding its support for quantum chip developers by applying its expertise in advanced packaging, heterogeneous integration and photonics manufacturing to address the challenges of scaling quantum computing systems.
As quantum technologies progress towards fault-tolerant computing, increasing qubit counts while maintaining performance and reliability presents significant manufacturing challenges.
EVG aims to address these requirements through precision wafer bonding, advanced lithography and heterogeneous materials integration.
The company's technology portfolio includes fusion and hybrid bonding, high-vacuum oxide-free bonding, nanoimprint lithography and thin-wafer processing.
These capabilities support high-density interconnects, 3D integration and the combination of different semiconductor materials within complex quantum architectures.
For photonic quantum computing, EVG's bonding technologies enable the integration of III-V and high-Pockels-coefficient materials with optical waveguides.
Its hybrid bonding processes also support high-density interconnections for spin-based quantum devices, while low-temperature metal bonding enables the integration of ion-trap and photonic chiplets.
EVG is also supporting quantum manufacturing development through its collaboration with Xanadu and participation in the CHAMP-ION pilot line project, which focuses on industrial-scale production of ion-trap quantum chips.
The company will showcase its quantum computing process solutions at SEMICON Europa 2026, taking place from November 10–13 in Munich, Germany.
The developments highlight the growing importance of advanced packaging and heterogeneous integration in enabling scalable quantum processors and next-generation photonic computing architectures.
