Dixon eyes SiPh and advanced packaging
The Indian electronics manufacturer is exploring new capabilities to serve growing demand from AI infrastructure and data centres.
Dixon Technologies is exploring expansion into silicon photonics and advanced semiconductor packaging as it seeks to address growing demand from AI infrastructure, data centres and high-speed computing.
The company is evaluating acquisitions and partnerships to establish manufacturing capabilities in India, including high-speed optical transceivers operating at 800G and above.
Dixon has already established a joint venture with Taiwan-based Gemtek to manufacture optical transceivers and is pursuing further partnerships to expand into advanced packaging and silicon photonics.
According to Dixon Vice Chairman and Managing Director Atul Lal, the company aims to bring these technologies to India to serve global markets. Group CFO Saurabh Gupta said the new businesses could offer higher margins than conventional electronics manufacturing.
The plans remain at an early stage, with no final investment commitments, manufacturing timelines or customer orders confirmed for the proposed silicon photonics and advanced packaging operations.
