Netherlands–Taiwan launch photonics projects
TechBridge projects target PIC integration, advanced packaging and optical interconnects for AI, wireless and quantum applications.
The Netherlands and Taiwan have announced four collaborative R&D projects under the TechBridge programme, bringing together expertise in photonic chip design, semiconductor manufacturing and advanced packaging to accelerate the commercialisation of integrated photonics.
The HEROIC project brings together Formerica OE, Hon Hai Research Institute, SMART Photonics and Eindhoven University of Technology to develop a 3.2 Tbps optical transceiver with 400 Gbps per lane.
The project will combine heterogeneous integration, flip-chip technology and immersion cooling to support next-generation AI data center interconnects.
Meanwhile, MAP-Connect, led by MicroAlign and Largan, will focus on mass-producible, ultra-low-loss 40-channel polarisation-maintaining fibre-array connections for photonic chips, addressing critical optical packaging and manufacturing challenges.
The PhoDAS project, involving Sabratha and TMYTEK, will develop photonics-enabled millimetre-wave radio units for future 5G and 6G networks using thin-film lithium niobate technology.
QSPAD, involving QuiX Quantum and Brillink, will develop integrated single-photon detectors operating near room temperature for quantum computing applications.
Announced on November 4, 2026, the four projects highlight growing Netherlands–Taiwan collaboration in scalable PIC manufacturing, heterogeneous integration and advanced photonic packaging, supporting the transition from research breakthroughs to commercially viable optical systems.
