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Synopsys expands access to PIC design tools

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Synopsys joins EuroCDP to give European startups and SMEs access to advanced semiconductor and photonic chip design tools.

Synopsys has announced an agreement with the European Chips Joint Undertaking (Chips JU) to expand access to its electronic design automation (EDA) tools through the European Chips Design Platform (EuroCDP), supporting semiconductor innovation across Europe.

Announced in Brussels on 4 November, the initiative will provide startups, small and medium-sized enterprises (SMEs) and research teams with streamlined access to Synopsys' design, verification and signoff solutions.

The agreement covers both Level 1 and Level 2 of the EuroCDP programme, supporting companies from early-stage development through to pre-production.

Alongside digital and analog/mixed-signal design capabilities, the offering includes photonic integrated circuit (PIC) design flows targeting optical networking, data centres and sensing applications.

EuroCDP participants will also benefit from access to intellectual property, training, funding and prototyping support, helping reduce barriers to advanced semiconductor design and commercialisation.

"Europe's next generation of semiconductor innovation will come from organizations of many different sizes, not only established chip companies," said Jari Kinaret, Executive Director of Chips JU.

Antonio Varas, Chief Strategy Officer at Synopsys, said the initiative would help European innovators turn research and design concepts into silicon, strengthening the region's semiconductor ecosystem.

Synopsys already works with European semiconductor companies including Axelera AI, Openchip and SiPearl. Its expanded involvement in EuroCDP supports the objectives of the European Chips Act, with a focus on strengthening Europe's capabilities in AI, high-performance computing and integrated photonics.

The agreement is expected to help emerging European chip developers access production-proven design technologies and accelerate the development of next-generation semiconductor and photonic devices.



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