UK expands packaging and photonics
The government-backed centre is broadening its remit to support AI hardware, defence and semiconductor integration, with a focus on advanced packaging, heterogeneous integration and optical interconnects.
The UK’s Compound Semiconductor Applications Catapult has relaunched as the Semiconductor Catapult, expanding its focus to advanced packaging, photonics and next-generation AI hardware.
The government-backed centre will support startups, SMEs and larger companies in developing, integrating, testing and validating semiconductor technologies through facilities in Newport, Bristol and Glasgow.
Its expanded remit covers four key areas: advanced packaging and heterogeneous integration, power electronics and thermal management, photonics and optical interconnects, and RF and mixed-signal integration.
For advanced packaging, the initiative aims to help companies validate semiconductor architectures, reduce technical risks and develop system-level integration capabilities.
For photonic integrated circuits (PICs), the focus on photonics and optical interconnects could support technologies that enable faster, more energy-efficient data transfer in AI systems and data centres.
The relaunch forms part of the UK government’s £1.1 billion AI Hardware Plan, which aims to strengthen domestic semiconductor capabilities and accelerate the commercialisation of emerging technologies.
The initiative highlights the growing convergence of advanced packaging and photonics as the UK seeks to strengthen its semiconductor supply chain and develop next-generation computing hardware.
