Photonics targets 400Gbps Links
Silicon photonics and heterogeneous materials are enabling higher-bandwidth optical devices while bringing PIC fabrication closer to scalable manufacturing.
Integrated photonics is advancing as demand for higher-bandwidth, lower-power optical interconnects grows across communications and data centre applications.
Imec is developing integrated photonics platforms covering device design, wafer fabrication, packaging and testing. Its process design kits (PDKs) and device libraries allow customers to develop photonic integrated circuits (PICs) using established manufacturing processes.
The push towards higher data rates is also driving new device and material approaches. Imec has developed silicon photonics technologies targeting electro-optical bandwidths above 100GHz and data rates of up to 400Gbps per lane.
Heterogeneous integration is playing an increasing role, with germanium-on-silicon used for photodetection and thin-film lithium niobate being integrated with silicon photonics for high-speed modulation. Imec and Ghent University have demonstrated lithium-niobate modulators integrated onto silicon photonic platforms using micro-transfer printing.
These developments highlight the growing importance of combining different materials and functions within manufacturable PIC platforms. As bandwidth increases, fabrication must be coordinated with optical coupling, packaging, thermal management and testing.
The move towards platform-based fabrication could help bridge the gap between photonic research and volume deployment, providing a pathway towards higher-speed optical interconnects for future data centres and communications systems.
