LITILIT expands AI laser production
Lithuanian laser manufacturer says AI infrastructure growth is driving demand for precision laser processing in advanced semiconductor packaging and optical interconnects.
LITILIT says the rapid expansion of AI data centre infrastructure is increasing demand for femtosecond laser technology used to manufacture advanced semiconductor packaging and optical interconnect components.
According to the company, femtosecond lasers enable ultra-precise material processing with minimal heat damage, making them well suited for manufacturing advanced AI hardware, including semiconductor packages, glass substrates, advanced PCBs and optical interconnects.
LITILIT highlighted glass interposers as one of the fastest-growing applications. Femtosecond lasers can drill microscopic through-glass vias (TGVs), which are subsequently filled with copper to create vertical electrical connections for chiplet-based architectures and high-performance AI systems.
"Many advanced AI components, from semiconductor packages, glass substrates, to optical interconnects and advanced PCBs, require manufacturing technologies that can process materials without introducing heat damage," said Nikolajus Gavrilinas, co-founder and CEO of LITILIT.
"Femtosecond lasers are becoming one of the key enabling tools for this transition, and we believe demand will grow rapidly as AI manufacturing scales."
The company cited growing adoption of co-packaged and near-packaged optics as another driver for precision laser processing, as AI systems require increasingly dense, high-speed optical interconnects.
To support future demand, LITILIT has developed a simplified femtosecond laser architecture based on patented technology designed for automated manufacturing.
Construction of the company's new laser manufacturing facility in Vilnius began in June 2026, with plans to replicate the production model internationally through future partnerships.
