Aehr wins follow-on SiPh order
The FOX-XP system will support expanded wafer-level reliability screening for next-generation silicon photonic integrated circuits.
Aehr Test Systems has received a follow-on production order from its lead silicon photonics wafer-level burn-in customer for a fully automated FOX-XP multi-wafer production burn-in system.
The system will support the customer’s continued manufacturing expansion for next-generation silicon photonic integrated circuits used in optical transceivers and emerging chip-to-chip optical I/O applications.
Configured with nine independent WaferPak test blades, the platform can deliver up to 3,500 watts per blade for production burn-in and reliability screening. It also includes automated wafer handling, alignment, loading and unloading capabilities.
Aehr said the order reflects the growing importance of wafer-level burn-in as silicon photonics moves towards higher-volume production.
Reliability screening before packaging can help identify latent defects, improve manufacturing yields and reduce overall production costs.
The company pointed to increasing demand from AI data centres for higher-bandwidth and lower-power optical interconnects, including co-packaged optics, optical switching, linear pluggable optics and chip-to-chip optical I/O.
Gayn Erickson, President and CEO of Aehr Test Systems, said the order indicated that silicon photonics was progressing from technology adoption into manufacturing scale-up.
The system is expected to ship during the first half of 2027.
