Atomica has launched its AI Photonic Integration Platform, a microfabrication platform designed to help developers integrate photonics, electronics, memory, thermal management and packaging into manufacturable AI systems.
The new platform is the latest addition to Atomica's AI infrastructure portfolio, following its AI Optical Connectivity Platform and AI Optical Source Platform.
Together, the three platforms address key elements of AI optical hardware, from generating and routing light to integrating optical functions with electronic and package-level components.
The AI Photonic Integration Platform combines microfabrication technologies including silicon and glass interposers, through-silicon vias (TSVs), through-glass vias (TGVs), redistribution layers, wafer-level packaging, bonding, optical alignment structures and customer-specific process layers.
According to Atomica, the platform is intended to support a broad range of AI applications, including AI accelerators, high-bandwidth memory (HBM) integration, chiplet packages, data centre switches, optical I/O modules, photonic integrated circuit (PIC) packaging, optical engines, external laser-source packages, advanced sensors, and co-packaged and near-packaged optics.
"The next leaps in AI hardware will not come from any single chip," said Eldon Klaassen, CEO of Atomica. "They will come from integration bringing logic, memory, optics and thermal management together into a manufacturable system."
Rather than offering individual process capabilities, the platform provides a configurable development pathway that enables customers to combine standard process modules with custom layers, supporting projects from early feasibility studies through prototype development, manufacturing readiness and scalable production.
Atomica said the platform addresses one of the key challenges facing next-generation AI hardware: integrating diverse photonic, electronic and memory components while maintaining optical performance, electrical performance and manufacturability.
