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Thursday 12th February 2026
Empower rolls out AI silicon capacitors
Thursday 12th February 2026
EV Group showcases hybrid bonding and maskless lithography technologies at SEMICON Korea 2026
Monday 9th February 2026
DARPA launches $35M program to scale photonic circuits for AI computing
Friday 6th February 2026
Accelerating MEMS and Photonics Scaling
Thursday 5th February 2026
UC Davis develops AI spectrometer chip
Wednesday 4th February 2026
Caltech achieves ultralow loss photonic chips
Tuesday 3rd February 2026
Dual function found in key photonic component
Monday 2nd February 2026
Constructor Capital closes $110m Fund I to back science-first startups from lab to market
Friday 30th January 2026
Atomic layer processing advances silicon carbide quantum photonic circuits
Thursday 29th January 2026
Global PIC market set to more than double by 2030
Wednesday 28th January 2026
Veeco and imec develop 300 mm–compatible process for integrating barium titanate on silicon photonics
Wednesday 28th January 2026
La Luce Cristallina launches CMOS-compatible oxide pseudo-substrate for scalable silicon integration
Tuesday 27th January 2026
Europe to secure lead in photonic chips
Tuesday 27th January 2026
PhotonDelta launches challenge to advance photonic-enabled systems
Monday 26th January 2026
CanopAI project secures funding to advance photonic integration for AI data centres
Friday 23rd January 2026
Neurophos raises $110m to push photonic AI chips into data centers
Thursday 22nd January 2026
Optalysys secures £23M to scale photonic computing
Thursday 22nd January 2026
POET wins Infostone Award for 1.6T PIC innovation
Wednesday 21st January 2026
Quantifi Photonics launches first PXI-based ELSFP solution for scalable CPO and PIC testing
Tuesday 20th January 2026
MIT boosts quantum cooling with photonic chip
Tuesday 20th January 2026
Ultralow-loss germano-silicate PIC platform breaks short-wavelength barrier
Monday 19th January 2026
LIGENTEC and X-FAB strengthen european photonics with SOI and TFLN integration
Monday 19th January 2026
PICs gain momentum as data centres and security needs drive adoption
Friday 16th January 2026
Aerotech, Santec, and SENKO launch revolutionary alignment system for co-packaged optics
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