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Industry News
Tuesday 6th October 2026
JEDEC sets SiPh reliability standard
Tuesday 6th October 2026
Photonics packaging market set to grow
Friday 2nd October 2026
OIF highlights AI optical interconnect work
Wednesday 30th September 2026
Hybrid PIC market set to grow by 2035
Friday 25th September 2026
3D integration reshapes CPO
Wednesday 9th September 2026
OIF defines 1.6T coherent interface
Wednesday 9th September 2026
Fujitsu advances diamond photonics
Friday 4th September 2026
MIT advances flexible silicon photonics
Wednesday 2nd September 2026
OIF advances optical interoperability
Wednesday 2nd September 2026
Photonics targets 400Gbps Links
Tuesday 1st September 2026
Australia opens PIC packaging facility
Thursday 27th August 2026
Photonics targets 6G wireless
Wednesday 26th August 2026
OIF showcases AI optical interconnects
Wednesday 26th August 2026
UCSB launches packaging prototyping hub
Wednesday 26th August 2026
Taiwan’s CPO supply chain expands
Wednesday 19th August 2026
Photonic chip market to hit $9.3bn
Tuesday 18th August 2026
NHanced advances photonic packaging
Monday 17th August 2026
Industry backs open CPO standards
Friday 7th August 2026
China protects photonic chip designs
Wednesday 5th August 2026
Hungarian team advances neurophotonic
Monday 3rd August 2026
GF, Aeluma receive CHIPS funding
Monday 20th July 2026
IEEE backs micro-transfer printing
Wednesday 15th July 2026
RIT joins laser technology hub
Tuesday 14th July 2026
Shanghai backs SiPh innovation
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