OIF launches seven connectivity projects
New initiatives target 200G optical links, external laser sources and energy-efficient 448G interfaces for AI and data-centre networks.
The Optical Internetworking Forum (OIF) has launched seven new technical projects aimed at advancing high-speed optical connectivity, energy-efficient interfaces and interoperability for AI and data-centre infrastructure.
The projects were initiated during OIF's Q4 2026 Technical and Market Awareness & Education Committees Meeting, held from November 2–5 in Bangkok, Thailand. The meeting attracted more than 200 representatives from member companies.
Among the new initiatives is a bidirectional O-band single-mode fibre interface supporting 200 Gbps per lane for AI scale-up networks.
The project aims to establish common specifications for high-bandwidth optical connectivity as AI systems demand greater data transfer capacity.
OIF also initiated development of an energy-efficient 448G retimed transmit linear receive (RTLR) interface, complementing its existing CEI-448G work.
The specification will address electrical interface requirements as network equipment moves towards higher data rates.
Two additional projects focus on external laser sources. These include the next revision of the External Laser Small Form Factor Pluggable (ELSFP) Implementation Agreement and a Type-3 elongated ELSFP variant supporting 40W operation.
External laser technologies are particularly relevant to silicon photonics and emerging optical integration architectures, where efficient laser delivery is important for high-density optical systems.
The remaining projects address MACsec management for pluggable modules, USB-based communication for the Common Management Interface Specification (CMIS), and ZRsec encryption for coherent optical interfaces.
According to OIF, the unusually high number of new projects reflects growing industry demand for interoperable connectivity technologies that can support increasing bandwidth and power-efficiency requirements.
The initiatives highlight the continuing development of optical and electrical interface standards needed to support next-generation photonic systems and AI networking infrastructure.
