OIF showcases AI optical interconnects
OIF will bring together 39 member companies at ECOC 2026 in Malaga to demonstrate interoperable technologies for AI-era optical networks, spanning optical systems, high-speed electrical interfaces, module management and co-packaged optics.
The live demonstrations at OIF’s booth will feature technologies including 400ZR and 800ZR coherent optics, 448Gbps-per-lane electrical interfaces, energy-efficient optical architectures and co-packaged optics (CPO).
The optical systems showcase will demonstrate 100G, 400G and 800G module applications, alongside coherent solutions for single- and multi-span networks, optical switching and IP/optical controller integration.
OIF members will also demonstrate 448G electrical connectivity aimed at scaling AI networks, alongside 224G architectures covering different link types.
The organisation’s Energy Efficient Interfaces work will highlight retimed, half-retimed and linear optical approaches designed to improve bandwidth density and reduce power consumption.
The demonstrations will also feature Common Management Interface Specification (CMIS) applications, including management of external laser modules for CPO, link training for 224G and higher-speed interfaces, and enhanced firmware management.
OIF will additionally showcase next-generation co-packaging technologies, including the Compute Optics Interface, external laser sources, high-density connectors, CPO and 12.8Tb/s near-package optics.
The programme reflects the industry's push toward higher-bandwidth, lower-power optical connectivity for AI infrastructure, while highlighting the importance of interoperability as these technologies move toward wider deployment.
