NcodiN raises €16M to industrialise photonic interposer platform with the world’s smallest laser
NcodiN, the Paris-based deep-tech startup pioneering photonic interposer technology, has secured €16 million in an oversubscribed Seed round to scale its optical connectivity platform from research to industrial deployment. The funding, led by MIG Capital with participation from Maverick Silicon, PhotonVentures, Verve Ventures and continued support from Elaia, Earlybird and OVNI, will accelerate production on 300 mm wafers, expand engineering teams and establish new customer and supply-chain partnerships, including a forthcoming presence in Silicon Valley.
NcodiN is developing NConnect, a new class of photonic interposers designed to overcome the “copper wall” limiting AI system performance. By integrating what the company describes as the world’s smallest laser, compatible with dense silicon integration, NConnect enables ultra-high-bandwidth optical links between chiplets, addressing one of the most acute bottlenecks in next-generation AI hardware. The platform’s ability to deliver supercomputer-level bandwidth within a single processor aligns with the growing demand for memory-intensive workloads as AI accelerators continue to evolve.
Over the past 18 months, NcodiN has demonstrated nanolaser efficiencies below 0.1 pJ/bit, integrated nanodetectors and complete optical links on silicon. The company has also built an independent cleanroom to support rapid prototyping and joint development, and has expanded its advisory network with leaders in silicon photonics and semiconductor engineering, including Eli Yablonovitch, Gus Yeung and Peter de Dobbelaere. Their involvement reinforces confidence in NcodiN’s approach to high-bandwidth, energy-efficient interconnects for advanced computing architectures.
With this funding, NcodiN aims to progress toward large-scale manufacturing partnerships and to position its photonic platform as a foundational technology for future AI infrastructure, enabling systems that exceed the performance and efficiency limitations of copper-based interconnects.
