Blair Morrison (L) and Alvaro Casas Bedoya (R) created a compact, optical circuit measuring 0.1 x 4mm, that they say could be mass manufactured and integrated into everyday electronic devices like smartphones
"Turning ideas into reality" â€“ this is the motto of the new Technology Center at PI (Physik Instrumente) which was inaugurated in front of more than 100 guests at PI's headquarters in Karlsruhe, Germany.
Lightwave's Mach-Zehnder Design now enables full standardized 100Gbps
Datacenter, Data Communications, and High-Performance Computing
Applications Using its Polymer Photonics Integrated Circuit (P2ICTM)
Aurora Semiconductor, LLC and BRIDG have signed a Letter of Intent to collaborate in the Osceola based Public-Private Partnership to support the technology development and manufacturing deployment of Auroraâ€™s 4D Heterogenous System in Package (4DHSiPTM) technology.
The Integrated Circuit Advanced Process Center of Institute of Microelectronics of Chinese Academy of Sciences (IMECAS) has recently released a silicon photonics platform based on an 8-inch Complementary Metal Oxide Semiconductor (CMOS) process line, marking a significant increase in R & D capability in the field of silicon photonics in China.