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PHIX Photonics Assembly to move to new facility


The PIC packaging company says its new location will support its growing team and enable a further industrialisation of its customers’ products

PHIX Photonics Assembly has announced that, from 3 June, it will occupy a new building in Enschede, The Netherlands. The company says its new site is fully tailored to its integrated photonics and micro-electromechanical systems (MEMS) packaging operations and a further scale-up to volume manufacturing.

With 1800 square metres of floor space and up to ISO 5 cleanrooms, PHIX says its new facility will have plenty of space and infrastructure to house its growing team and state-of-the-art equipment for the volume manufacturing of optoelectronic modules based on PICs and MEMS. One example of new equipment that the company plans to house there is the ASMPT Amicra Nano die bonder and flip chip tool, which will arrive in September.

Apart from supporting PHIX’s own growth and expansion, this new facility is intended to enable a further industrialisation of the innovations of its customers, advancing the photonic chip industry as a whole. Due to the move, manufacturing operations will be interrupted from 6-19 June.

Image credit: PHIX Photonics Assembly

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