Loading...
News Article

A NEW IPM WITH CIP TOPOLOGY


Vincotech, a supplier of module-based solutions for power electronics, has announced the launch of a new, deeply integrated Intelligent Power Module for 600 V applications. The flowIPM 1B CIP 600 V features  the powerful combination of a high-speed F5 IGBT with the switching performance of a MOSFET and a silicon carbide boost diode in the PFC circuit optimized for frequencies up to 150 kHz.

The high-speed F5 IGBT, paired with the silicon carbide boost diode in the PFC circuit, not only delivers impressive performance, it also drives down the cost of external passive components. The current rating of this new CIP (converter + inverter + power factor correction) topology housed in an integrated power module is also impressive: 10 A @ 80°C heat sink temperature.

The deeply integrated flowIPM 1B CIP 600 V module enables manufacturers to slash their overall system's size, cost, and time to market. It also features an inverter gate drive with a bootstrap circuit for high-side power supply, as well as emitter shunts (30 mΩ) for vastly improved motion control.

The new flowIPM 1B CIP 600 V modules come in 17 mm flow 1B housings. Versions in the 12 mm housing, with Press-fit pins and with phase-change material are available on request. Samples may be sourced on demand from our usual channels.

To learn more about Vincotech's flowIPM 1B CIP, please visit: http://www.vincotech.com/en/products/new-products/2016/flowipm1bcip.html

 

Lightwave Logic receives ECOC Innovation Award for Hybrid PIC/Optical Integration Platform
Coherent wins ECOC award for datacentre innovation
HyperLight announces $37 million funding round
Jabil expands silicon photonics capabilities
Ephos raises $8.5 million for glass-based photonic chips
Designing for manufacture: PAM-4 transmitters using segmented-electrode Mach-Zehnder modulators
OpenLight and Epiphany partner on PIC ecosystem
NewPhotonics and SoftBank team up on advanced photonics
POET and Mitsubishi collaborate on 3.2T optical engines
Integrated photonic platforms: The case for SiC
Integrating high-speed germanium modulators with silicon photonics and fast electronics
Lightium Secures $7 Million Seed Funding
Revolutionising optoelectronics with high-precision bonding
Fraunhofer IMS invites participation in PIC engineering runs
Advances in active alignment engines for efficient photonics device test and assembly
Aeva announces participation at IAA Transportation 2024
Sumitomo Electric announces participation in ECOC 2024
Quside receives NIST certification for quantum entropy source
DustPhotonics launches industry-first merchant 1.6T silicon photonics engine
Arelion and Ciena announce live 1.6T wave data transmission
DGIST leads joint original semiconductor research with the EU
POET Technologies reorganises engineering team
A silicon chip for 6G communications
South Dakota Mines wins $5 million from NSF for Quantum Materials Institute
HieFo indium phosphide fab resumes production
Coherent launches new lasers for silicon photonics transceivers
AlixLabs wins funding from PhotonHub Europe
Sandia National Labs and Arizona State University join forces
Perovskite waveguides for nonlinear photonics
A graphene-based infrared emitter
Atom interferometry performed with silicon photonics
A step towards combining the conventional and quantum internet

×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the PIC Magazine, the PIC Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: