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Wednesday 1st March 2017
The emergence of advanced modulation techniques in optical transmission provided the perfect opportunity for HHI to strengthen work on InP PICs, as Norbert Grote – former deputy director of the organization’s photonic components department and now a senior adviser– explains.
Wednesday 1st March 2017
Very high data rates and tremendous temperature stability make the InP quantum dot laser a very promising contender for tomorrow’s optical networks. Johann Peter Reithmaier from University of Kassel and Gadi Eisenstein from Technion report on recent progress in the lab and share their results with PIC International’s sister title - Compound Semiconductor magazine.
Wednesday 1st March 2017
There has been a rapid and strong wave of support responding to PhotonDelta’s call in the December issue of PIC International magazine for more long-term technology planning. Jonathan Marks updates on reaction to the roadmap proposal and announces key dates for your diary.PhotonDelta and AIM Photonics are now working together to organise the first meeting of the World Technology Mapping Forum. The goal is to produce the first International Photonic Systems Roadmap, looking ahead to global technology needs in 2030 and beyond.
Wednesday 1st March 2017
Ségolène Olivier, an R&D project leader on advanced silicon photonics components at Leti, reviews some of the latest platform enhancements towards more compact, high-performance and power-efficient PICs for telecom networks and data centre applications.
Wednesday 1st March 2017
André Richter, Sergei Mingaleev and Igor Koltchanov of VPI Photonics discuss the power of a layout-aware schematic-driven design methodology for accelerating the application of integrated photonics.
Thursday 1st December 2016
The network of Fraunhofer Institutes, which has links all over the world, explores a variety of applied research themes across a range of disciplines. James Tyrrell interviews Martin Schell, director of the Fraunhofer Heinrich-Hertz-Institute (HHI) Berlin, to discover more about its work in the area of photonic integrated circuits, and find out how his team works with industry to develop promising concepts to the level of manufacturing maturity.
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Thursday 1st December 2016
What solutions are in the pipeline to support higher performance devices in a post-Moore era? Koji Yamada, head of the Silicon Photonics Group at the Electronics and Photonics Research Institute - a division of Japan's National Institute for Advanced Industrial Science and Technology (AIST), explores the opportunities provided by silicon photonics and discusses the next steps for this exciting PIC platform.
Thursday 1st December 2016
Augmenting traditional transfer moulding with Film Assisted Moulding and Dynamic Insert Technology can deliver a range of benefits to PIC makers. As well as providing necessary packaging attributes, the approaches allow additional functionality to be inserted such as lens structures or through polymer vias. Marco Koelink of the Advanced Packaging Center in The Netherlands provides an overview of the technology, including recent developments in die-attach, and shares device examples from solar, automotive and other key sectors.
Thursday 1st December 2016
Developers are working hard to simplify the assembly of integrated photonic devices so that chips can enter a broad range of markets at more attractive price-points. Ian Oxtoby, optical packaging manager at Optocap, shares the firm's strategy for bringing down the cost and complexity of PIC packaging.​
Thursday 1st December 2016
To keep pace with an increase in the demand for high-performance optical components, producers will need to consider automation of their processes in more detail. Dylan J. Burke of Yelo – a firm specialising in automated device measurement – looks at what’s driving the market and discusses the challenges that device makers face in relation to burn-in and test of devices at high volume. Included in his review are examples of the developments Yelo has been working on to help PIC firms in ramping up production.
Thursday 1st December 2016
Ton Backx, CEO of PhotonDelta, has a new goal in the coming year. He plans to kick-start international discussions about the optical technologies needed for global society two decades from now. He outlined what’s happening and why to Jonathan Marks.
Thursday 1st December 2016
How can you improve the coupling efficiency between optical fibres and photonic integrated circuits? Florent Gardillou -- technical project leader and business development manager at Teem Photonics -- takes a detailed look at the latest transposer technology and its application in silicon photonics-based designs, as well as reviewing the firm’s broader activity in advancing PICs.
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Thursday 1st September 2016
James Tyrrell interviews Bert Offrein, manager of the photonics group at the IBM Research Laboratory in Zurich, to find out what makes PICs so appealing and to discuss opportunities where developers can team-up to smooth the path for wider adoption of novel devices.
Thursday 1st September 2016
Rob Kalman, director of product management for Kaiam, describes how advances in PIC technology can improve fibre-optic links and open up additional markets
Thursday 1st September 2016
PICs offer a radically different approach to space exploration, as experts from Lockheed Martin’s Advanced Technology Centre explain in an exclusive article prepared for PIC International Magazine.
Thursday 1st September 2016
The growth in cloud-based services and other bandwidth-intensive applications sets the scene for further advances in PIC technology. Adam Carter, chief commercial officer at Oclaro, looks at some of the developments coming through into the market and the various processing steps required to create a device.
Thursday 1st September 2016
Paul van Dijk - CEO of SATRAX, based in Enschede, The Netherlands - tells Jonathan Marks of PhotonDelta why those planning next generation 5G networks need to consider coverage and capacity if they want more robust networks that are 10 times faster than today.
Thursday 1st September 2016
Twan Korthorst, CEO of PhoeniX Software, highlights how ‘Photonic Synthesis’ is enabling developers to share foundry resources and ramp up the pace of device development by making the design process much more straightforward.
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Thursday 1st September 2016
Lê Nguyên Bình, technical director at Huawei’s European Research Institute in Germany, examines the role of integrated photonics in addressing the convergence of wireless and optical transport networks.
Wednesday 1st June 2016
James Tyrrell interviews Peter O’Brien, leader of the Photonics Packaging and Integration Group at the Tyndall National Institute to review the challenges facing the industry today; discuss ways ahead through closer collaboration, innovation in device design and opportunities for standardisation; and highlight what’s driving the use of photonic integrated circuits.
Wednesday 1st June 2016
PIC International 2016 presented attendees with a packed two-day programme exploring photonic integrated circuit development and application, including strategies for delivering light at the chip-level. Richard Stevenson shares his analysis of the device options detailed by industry speakers at this year’s show.
Wednesday 1st June 2016
Integrating electronic and photonic design methods is key to unlocking the full potential of PIC devices in the marketplace. Lumerical, Cadence Design Systems and PhoeniX Software review the steps that need to be overcome and propose a pathway towards a unified design automation environment.
Wednesday 1st June 2016
What does it take to go from idea to final device? Iñigo Artundo, CEO of VLC Photonics, introduces the process and prepares you for the journey.
Wednesday 1st June 2016
What steps can be taken to streamline the industrialisation of PIC devices and broaden their impact in markets such as metrology, process control and safety systems, as well as supporting new developments in telecoms and data infrastructure? Valentina Moskalenko, Katarzyna Ławniczuk, Meint Smit and Kevin Williams of Europe’s JePPIX initiative outline the options that are available through their multi-project wafer programme.

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