Loading...
News Article

Intel and Tyndall National Institute renew $1.5 Million research partnership

News
3-year collaboration between Intel and Cork research institute to have impact on future electronics

Managing Director of Intel Labs Mike Mayberry and Dr. Kieran Drain, CEO of Tyndall National Institute, are pictured at the announcement of a $1.5 million research partnership between Intel and Tyndall which will see the two work together to investigate next-generation materials, devices and photonics technologies to make an impact on the challenges of developing future electronic devices.

Intel and Tyndall National Institute in Cork have announced the renewal of a $1.5 million research partnership. Intel has committed to invest $1.5 million over the next three years in developing innovative technology with Ireland's leading ICT research institute, building on the investment of previous phases and reflecting the success of their collaborative research. The partnership, which has gone through two 3-year phases since 2009, will now run until 2018.

The agreement between Intel and Tyndall is a unique program within Intel, involving a direct relationship between researchers at Tyndall and Intel's components research group in Portland, Oregon. Under the agreement, Intel and Tyndall will work together to investigate next-generation materials, devices and photonics technologies. Tyndall's expertise in the field of semiconductor technology has been fundamental to the partnership with Intel, and both organisations anticipate building on the work of the first two phases of the program to make an impact on the challenges of developing future electronic devices. As in previous years, the partnership provides Intel with a commercial exploitation licence to technology created through the collaboration with Tyndall.

Bernie Capraro, Research Manager, Silicon Technology at Intel Ireland, said "We're delighted with the collaboration with Tyndall. The standard of work from Tyndall researchers is top-class, from the work that Dr. Jim Greer does in device modelling to the photonics work of Brian Corbett. The researchers in Tyndall will be working directly with Intel's researchers in Portland, which is the essence of the programme and what makes it so effective." We particularly appreciate Tyndall's flexibility, because we do alter the research programme from year to year depending on what needs we have and how our interests change.

Intel emphasise that Tyndall's industry-focussed approach and broad knowledge across the spectrum of ICT initially attracted the company to work with the institute on a long-term basis.

"This partnership started six years ago, and what we liked about Tyndall was the breadth of technology that they had," said Bernie Capraro. "Because of that breadth, it made sense for us to sponsor a large programme. We anticipate that Tyndall will continue to deliver on projects, and to adapt and be flexible, as they have done so far. We also hope that Tyndall will teach us about new concepts and possibilities. Often, Tyndall researchers bring solutions to Intel "“ rather than us coming to them with a problem, they will come to us with an opportunity, and we will evaluate whether it is something of interest that we could look at together. We appreciate Tyndall's assistance in looking into the future of semiconductor technology and Moore's Law, and their insights in evaluating potential future solutions."

Dr. Kieran Drain, CEO of Tyndall National Institute, said, "It's a great honour for us to have the partnership renewed, and it's a major vote of confidence in the institute. Intel has world-class research partners on its doorstep in the western United States, so the fact that they would come thousands of miles to work with us here at Tyndall is reflective of our ability to offer a valuable alternative viewpoint."

Intel Research Manager Bernie Capraro, Dr. Kieran Drain, CEO of Tyndall National Institute, Managing Director of Intel Labs Mike Mayberry and Intel Ireland General Manager Eamonn Sinnott are pictured at the announcement of a $1.5 million research partnership between Intel and Tyndall which will see the two work together to investigate next-generation materials, devices and photonics technologies to make an impact on the challenges of developing future electronic devices.

"We have excellent scientists who have a creative approach to future challenges associated with the extension of Moore's Law and Intel's migration towards a focus on the Internet of Things. We are looking forward to continuing to work with Intel on major challenges, such as scaling, and examining new transistor architectures for high density chips that can have a clear path to manufacturing with attractive economics. It requires new thought and a new approach to ensure that as chips get smaller and more power efficient, they also continue to get less expensive."

The current phase of the research partnership between Intel and Tyndall National Institute will run until 2018, under the direction of Bernie Capraro, Research Manager, Silicon Technology at Intel Ireland, and Peter Smyth, Business Development Executive at Tyndall.

Lightwave Logic receives ECOC Innovation Award for Hybrid PIC/Optical Integration Platform
Coherent wins ECOC award for datacentre innovation
HyperLight announces $37 million funding round
Jabil expands silicon photonics capabilities
Ephos raises $8.5 million for glass-based photonic chips
Designing for manufacture: PAM-4 transmitters using segmented-electrode Mach-Zehnder modulators
OpenLight and Epiphany partner on PIC ecosystem
NewPhotonics and SoftBank team up on advanced photonics
POET and Mitsubishi collaborate on 3.2T optical engines
Integrated photonic platforms: The case for SiC
Integrating high-speed germanium modulators with silicon photonics and fast electronics
Lightium Secures $7 Million Seed Funding
Revolutionising optoelectronics with high-precision bonding
Fraunhofer IMS invites participation in PIC engineering runs
Advances in active alignment engines for efficient photonics device test and assembly
Aeva announces participation at IAA Transportation 2024
Sumitomo Electric announces participation in ECOC 2024
Quside receives NIST certification for quantum entropy source
DustPhotonics launches industry-first merchant 1.6T silicon photonics engine
Arelion and Ciena announce live 1.6T wave data transmission
DGIST leads joint original semiconductor research with the EU
POET Technologies reorganises engineering team
A silicon chip for 6G communications
South Dakota Mines wins $5 million from NSF for Quantum Materials Institute
HieFo indium phosphide fab resumes production
Coherent launches new lasers for silicon photonics transceivers
AlixLabs wins funding from PhotonHub Europe
Sandia National Labs and Arizona State University join forces
Perovskite waveguides for nonlinear photonics
A graphene-based infrared emitter
Atom interferometry performed with silicon photonics
A step towards combining the conventional and quantum internet

×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the PIC Magazine, the PIC Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: