Loading...
News Article

EV Group Sees Strong Demand For Emerging Photonic Applications

News

EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that its NILPhotonics Competence Center"”established to assist customers in enabling new and enhanced products and applications in the field of photonics"”has generated strong interest from customers and resulted in multiple system orders since its launch in December 2014. New system orders have included the company's EVG700/7000 Series UV-NIL (UV nanoimprint lithography) systems with SmartNIL technology to support high-volume manufacturing applications, including displays, light emitting diodes (LEDs) and wafer-level optics.  

Since its initial launch, the NILPhotonics Competence Center has also expanded the products and applications it is supporting. These include photonic and microfluidic devices for bio-medical applications that pave the way for faster and more accurate diagnosis of diseases, as well as plasmonic structures that simultaneously carry optical and electrical signals and can be scaled to the smallest dimensions to enable new chip designs as well as better-performing devices, such as waveguides and sensors.

"The prevailing perception has been that despite the potential benefits of NIL technology, the barrier to entry for integrating it into high-volume manufacturing (HVM) is high. That simply isn't the case. EV Group has invested significant resources over many years in developing NIL technology as an HVM-capable solution for a number of applications," stated Markus Wimplinger, corporate technology development and IP director at EV Group. "Today, we have the world's largest installed base ofmore than 200 systems at customer facilities around the globe supporting volume-manufacturing of LEDs, MEMS, optics, photovoltaics and other devices. Our NILPhotonics Competence Center allows us to more easily bring all of our process and product capabilities and expertise to bear in helping our customers enable new photonic products and applications."

EVG's NILPhotonics Competence Center leverages EVG's field-proven process and equipment know-how in NIL and other process areas such as wafer bonding to support emerging photonic applications and significantly shorten time to market through fast process implementation and optimization, as well as through customized equipment design. In addition, EVG has a global partner network to draw from to support its customers' process integration and optimization efforts across the NIL infrastructure, including template manufacturing, resist materials and supporting equipment. As a result, EVG is able to provide consultation and support across all phases of the product lifecycle"”from design for manufacturing and prototyping through process development, qualification runs, pilot manufacturing and process transfer.

"More than a decade ago, EV Group launched the NILCom Consortium with support from companies representing key aspects of the NIL supply chain in order to speed commercialization of NIL technology. Through the dedicated efforts of all of our members, we are pleased to announce that the NILCom Consortium has successfully completed its charter and will end formal operations. That said, we will continue to collaborate with companies across the NIL supply chain including our former members as needed to ensure that NIL technology continues to address future customer roadmap requirements," added Wimplinger.

Lightwave Logic receives ECOC Innovation Award for Hybrid PIC/Optical Integration Platform
Coherent wins ECOC award for datacentre innovation
HyperLight announces $37 million funding round
Jabil expands silicon photonics capabilities
Ephos raises $8.5 million for glass-based photonic chips
Designing for manufacture: PAM-4 transmitters using segmented-electrode Mach-Zehnder modulators
OpenLight and Epiphany partner on PIC ecosystem
NewPhotonics and SoftBank team up on advanced photonics
POET and Mitsubishi collaborate on 3.2T optical engines
Integrated photonic platforms: The case for SiC
Integrating high-speed germanium modulators with silicon photonics and fast electronics
Lightium Secures $7 Million Seed Funding
Revolutionising optoelectronics with high-precision bonding
Fraunhofer IMS invites participation in PIC engineering runs
Advances in active alignment engines for efficient photonics device test and assembly
Aeva announces participation at IAA Transportation 2024
Sumitomo Electric announces participation in ECOC 2024
Quside receives NIST certification for quantum entropy source
DustPhotonics launches industry-first merchant 1.6T silicon photonics engine
Arelion and Ciena announce live 1.6T wave data transmission
DGIST leads joint original semiconductor research with the EU
POET Technologies reorganises engineering team
A silicon chip for 6G communications
South Dakota Mines wins $5 million from NSF for Quantum Materials Institute
HieFo indium phosphide fab resumes production
Coherent launches new lasers for silicon photonics transceivers
AlixLabs wins funding from PhotonHub Europe
Sandia National Labs and Arizona State University join forces
Perovskite waveguides for nonlinear photonics
A graphene-based infrared emitter
Atom interferometry performed with silicon photonics
A step towards combining the conventional and quantum internet

×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the PIC Magazine, the PIC Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: