+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
Loading...
News Article

Infinera InP devices expand TeliaSonera International Carrier

The firm has accomplished this with its indium phosphide (InP) based Super-Channel SD-FEC
Infinera says it has the ability to double capacity on a key link in TeliaSonera International Carrier's (TSIC) North America terrestrial network using the world’s first super-channel implementation of  Soft Decision Forward Error Correction (SD-FEC).

This is featured on the Infinera InP based DTN-X platform and the company has successfully completed this verification test on a production route in TSIC’s North America network.

The company also announced that the SD-FEC capability is now generally available on the DTN-X platform.

The test was performed on TSIC's Houston to Phoenix fibre link and verifies the ability of Infinera's SD-FEC technology to double the available transmission capacity on this network link. SD-FEC is an advanced error detection and correction technology that enables transport networks to deliver error-free digital information at extremely high data rates and over very long distances, offering networks greater capacity and reach without the need to regenerate the signal en route.

Infinera says its DTN-X platform delivers the industry’s only long haul FlexCoherent 500 Gigabit per second (Gb/s) super-channels based 500 Gb/s Photonic Integrated Circuits (PICs) and the FlexCoherent Processor.

The company has deployed DTN-X networks in 30 countries with hundreds of super-channels activated into production. The DTN-X now offers SD-FEC, which is integrated into Infinera's third generation FlexCoherent Processor chip and combined with a world-record Polarisation Mode Dispersion (PMD) compensation capability that is specifically engineered to optimise capacity and reach.

"As network operators face increasing capacity requirements, they continue to seek solutions at the optical layer that add features and services to increase reach and capacity for 100G and beyond," says Ron Kline, principal analyst, network infrastructure at Ovum.

“Service providers are continuously looking to make better use of their network assets so an SD-FEC enabled 500G supper-channel that nearly doubles the reach of the current system will really resonate with large network operators,” he continues.

Mattias Fridström, Head of Technology at TSIC and keynote speaker at the coming DWM America conference notes, "We operate one of the world's most extensive fibre backbones across North America and Europe including Russia. We operate networks in a variety of environments and conditions; Infinera has proved with us that SD-FEC can double the capacity of key routes on our network.”

Infinera Co-founder and President David Welch adds, “Earlier this year, we demonstrated our third generation FlexCoherent Processor, integrated with SD-FEC along with 500 Gb/s PICs, in a trial that doubled capacity on a submarine cable link from Hawaii to California. Today, we are pleased to announce that these benefits can also be delivered in a terrestrial environment and that the industry’s first super-channel SD-FEC solution is now generally available."

The Intelligent Transport Network, featuring the DTN-X, enables carriers to use time as a weapon to increase revenues with highly reliable, differentiated services while reducing operating costs through scale, multi-layer convergence and automation.

TeliaSonera International Carrier is part of TeliaSonera Group, owner and operator of one of the world’s most extensive fibre backbones, the first to be 100G enabled across Europe and North America. TSIC has deployed an Infinera Intelligent Transport Network in North America and in northern Europe.

EMCORE announces integration of PICs into its products
Scottish photonics consortium wins £4.7m in UKRI funding
Yuanjie Semiconductor to supply lasers to POET
Fraunhofer IPMS announces government funding for quantum photonic chip
POET Technologies partners with Yuanjie Semiconductor Technology
SiLC announces silicon photonics systems for machine vision
Scientists develop novel optical modulators for integrated photonics
Scientists report integrated photodiodes on TFLN
Coherent wins award for innovative photonics product
FBH to present quantum technology developments at EQTC 2023
Skorpios and FormericaOE demonstrate PICs in 800G optical transceivers
EFFECT Photonics verifies fully integrated InP PIC
NASA awards grant for silicon photonics project
OpenLight and Spark Photonics partner on PIC design services
DustPhotonics announces 800G chip for hyperscale data centres and AI
Lightwave Logic Receives Industry Innovation Award
Imec announces SiGe BiCMOS optical receiver
SiFotonics announces silicon photonics 800G LPO solutions
Rockley Photonics progresses noninvasive biomarker monitoring
MantiSpectra secures €4 million for miniaturised spectrometers
Sivers to demo next-gen laser arrays at ECOC 2023
ASMPT AMICRA and Teramount collaborate on silicon photonics packaging
Quantum Computing Inc. selects Arizona site for photonic chip foundry
German government to fund ams OSRAM optoelectronic semiconductor development
Luceda Photonics introduces new PIC design software
Vodafone explores silicon photonics for future mobile networks
Coherent introduces 1200 mW pump laser module
Photonics startups invited to apply to Luminate NY accelerator
New tool could improve lithography for smaller, faster chips
InP-based lasers surpass 2.2 mm
Indie Semiconductor buys Exalos AG
New technique controls direction and wavelength of emitted heat

×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the PIC Magazine, the PIC Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: